Silanna Semiconductor has begun full‑scale production of what it describes as the industry’s smallest and most efficient ...

NVIDIA’s Vera Rubin is its next‑generation rack‑scale AI computing platform, which has been designed as a full system. It is now in production and being shipped to partners and CES saw the unveiling ...

Fraunhofer IPMS has developed a new 10G Time‑Sensitive Networking (TSN) endpoint IP core that’s been designed to meet growing ...

Applied Materials is reported to be facing a $252 million penalty after agreeing to settle allegations that it illegally exported semiconductor manufacturing equipment to China’s leading foundry, ...

Tower Semiconductor and Scintil Photonics have announced the availability of DWDM lasers for AI infrastructure.

A European consortium led by imec has received fresh EU backing to continue operating and expanding Europractice.

There is no doubt that electronic devices are getting smaller. Smart phones, once the size of a brick, are now compact pocket ...

Navitas Semiconductor has introduced its fifth-generation GeneSiC silicon carbide (SiC) platform, unveiling new high‑voltage ...

A white paper aims to help companies design, launch and maintain safe AI‑enabled medical devices across global markets.

Samsung Electronics has started shipping its latest HBM4 memory chips to global customers, stepping up efforts to challenge market leader SK Hynix in supplying key components for Nvidia’s artificial ...

SemiQ signs distribution agreement with NAC Semi in a move aimed at expanding the availability of its SiC solutions.

Toshiba Electronics Europe expands its range of electronic fuse devices with the introduction of the 40V TCKE6 series.